Feng Wang

Feng Wang currently serves as the Head of Silicon Validation & Productization at Etched since September 2025. Prior to this role, Feng held various positions at Waymo from March 2019 to September 2025, including Team Lead and Manager for Silicon Validation, IC Packaging, SIPI, and System DV. Earlier experience includes a progression of roles at Apple from September 2015 to March 2019, culminating as a Senior Signal Integrity Engineer, and positions at Apache Design Solutions and The Ohio State University, where significant research work on a fast numerical algorithm for 3D periodic dielectric structures was conducted. Feng holds a PhD in Computational Electromagnetics and a Master of Science in Electrical Engineering from The Ohio State University, along with a Bachelor of Science in Electrical Engineering from Nanjing University of Science and Technology.