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Binu Raghavan

Senior Engineer at Ethernovia

Binu Raghavan is a highly experienced engineer with a strong background in FPGA and firmware design. Binu has worked in various roles and companies, showcasing their expertise and versatility in the field.

Starting in 2004, Binu worked as a Senior IC Design Engineer at NXP, which later acquired Freescale Semiconductor. Binu then moved on to Reptechnic Design, where they served as a Senior Hardware Design Engineer from 2006 to 2007.

In 2007, Binu joined the NASDAQ OMX Group Corporate Services Inc as a Software Developer, further diversifying their skill set. Binu then worked at Indra in 2009 as a Senior Hardware Design Engineer.

From 2010 to 2011, Binu held the position of Field Application Engineer at Avnet, specializing in Xilinx and Analog Devices. Binu then became a Senior Xilinx Field Application Engineer, responsible for accelerating the adoption of Xilinx All Programmable Devices.

Starting in 2015, Binu worked as a Senior FPGA Engineer at Metamako until 2018, when they joined Baraja as a Senior Firmware Engineer. At Baraja, they played a key role in embedded firmware design for LiDAR systems used in self-driving vehicles, implementing DSP algorithms in SoC FPGA fabric across three product generations.

In 2022, Binu became the Principal FPGA Engineer at Morse Micro, where they worked until 2023. Currently, they hold the position of Senior Engineer at Ethernovia.

Binu Raghavan's extensive work experience demonstrates their technical expertise and dedication to the field of engineering.

Binu Raghavan holds a Master's degree in Microelectronic Engineering from RMIT University, which they obtained in 2004. Prior to that, they earned another Master's degree in Electrical and Electronics Engineering from Santa Clara University in 2001. Binu completed their undergraduate studies at Rajiv Gandhi Institute of Technology, Kottayam, where they obtained a BTech degree in Electronics and Communication Engineering from 1995 to 1999. Binu Raghavan has also obtained additional certifications, including IEEE Membership, Level 2 FAE from Analog Devices, and Xilinx FAE from Xilinx. However, specific information about the dates and institutions for these certifications is not provided.

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Timeline

  • Senior Engineer

    June, 2023 - present