FlipChip International is a world leading WLCSP bumping supplier, with wafer dicing and thinning capabilities, ASIC, ASPP and ASSP design, and a complete IC service from design to packaging.

Semiconductor

FlipChip International, LLC

FlipChip International, LLC's headquarters in Phoenix, AZ, United States

Bob Forcier

Dejen Eshete

Dawn Cuevas

The Engineering Team at FlipChip International is responsible for developing and optimizing advanced wafer-level chip scale packaging (WLCSP) processes, ensuring efficient manufacturing operations, and maintaining and improving equipment reliability. This multidisciplinary team collaborates on process design, equipment maintenance, and production testing to deliver high-quality IC services from design through to packaging, ultimately driving innovation and efficiency in semiconductor manufacturing.

Engineering Team

The Quality Assurance Team at FlipChip International ensures that all products meet stringent quality and reliability standards throughout the manufacturing process. This team actively monitors production practices, conducts rigorous testing and validation, and implements quality improvement initiatives to uphold the company's reputation as a leading WLCSP bumping supplier. By collaborating closely with engineering and supply chain teams, they help maintain high levels of customer satisfaction and product excellence.

Quality Assurance Team

This department focuses on designing and developing products through engineering expertise.

FlipChip International, LLC

Org chart

Teams

Engineering Team

Quality Assurance Team

Engineering Department

Offices

FlipChip International, LLC

Org chart

Teams

Engineering Team

Quality Assurance Team

Engineering Department

Offices

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