Jon Flack is an experienced application engineer currently working at Foamtec International WCC since April 2025, having previously held the role of applications/sales engineer at Foamtec International from June 2018 to December 2022. Jon Flack has a notable background in the semiconductor industry, with prior positions as an etch equipment engineer at Samsung Austin Semiconductor and Broadcom Limited, where strong problem-solving and data analysis skills were applied to enhance manufacturing processes. Between 2022 and 2025, Jon Flack served as a plasma etch equipment engineer at Texas Instruments. Educational credentials include a Bachelor of Science in Mechanical Engineering from Boise State University, achieved between 2004 and 2010. Additionally, Jon Flack has teaching experience as a tutor in fluid mechanics.
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