文峰 洪

文峰 洪 has over 21 years of experience in the computer and consumer electronics manufacturing industry. They worked as a QE owner for Nokia PCB project at 华通电脑 from July 2000 to January 2003, where they were responsible for quality engineering and managing the Bluetooth board project. They then joined 宏达电 as a Senior Manager from February 2003 to January 2021, where they had various responsibilities such as drawing up phone/VR shipping quality levels and defining primary cosmetic specifications. In March 2021, 文峰 洪 joined Ring as a Supplier Quality Manager and successfully handled a security device project from development stage to EOL. Currently, they are serving as the Head of Quality at FORME, starting from July 2021. In this role, they have collaborated with supplier quality partners to enhance the CM's capabilities in various quality areas such as ESD protection, IQC/OQC control plan, GR&R, ORT, and product traceability.

文峰 洪 attended I-Shou University, where they obtained a Bachelor's degree in Industrial Engineering. The duration of their education at this institution is not specified.