Angelo Estonilo is a Test Engineer at Foxconn since September 2023, with prior experience as a Product Development Engineer at TF AMD Microelectronics Penang from April 2022 to July 2023. Angelo has a strong background as a Process Engineer at Amkor Technology, Inc. from March 2010 to March 2022, specializing in Underfill and Encapsulation processes, as well as end-of-line processes including Saw Singulation, Lasermark, and Mold. Additionally, Angelo served as an Equipment Specialist, focusing on the maintenance and troubleshooting of Underfill machines and handling various equipment across multiple processes such as Mold, Lasermark, Singulation, and Paste Dispense. Angelo holds a Bachelor of Engineering degree in Manufacturing Engineering from the Technological University of the Philippines, completed between 2014 and 2016.
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