佳緯 林

佳緯 Mr. 林 is an experienced engineering professional with a robust background in failure analysis and new product introduction. Currently serving as the New Product Introduction Deputy Manager at 富士康 since November 2022, Mr. 林 leads a cross-functional team focused on troubleshooting design, material, and production issues while maintaining a target first pass yield of 97%. Previously, Mr. 林 held the position of R&D Assistant Technical Manager at 緯創資通, where responsibilities included training RD members in debugging processes and managing special projects, such as the Blackberry Motherboard rework. Additionally, Mr. 林 has served as a TPM Failure Analysis Section Manager at 仁寶 and as a Senior Engineer at 和碩聯合 and Sanyo Manufacturing Corporation, developing expertise in PCB and appliance troubleshooting, as well as analytical problem-solving skills. Currently pursuing further education at 元智大學, Mr. 林 remains committed to driving engineering excellence and innovation.