EDGE: Scaling Intelligence Beyond the Third Dimension.

FS2 (Future Semiconductor 2D materials) is moving AI hardware from "one day" to "day one." Founded in 2024 on breakthrough research from MIT, FS2 is building the foundation for Intelligence at the Edge — by eliminating the fundamental barrier in 3D chip integration.

The semiconductor industry has hit the physical limits of planar scaling. FS2’s answer is Monolithic 3D — a growth-based technology that vertically integrates logic and memory transistors into a single chip, without the thick silicon wafer substrates that have constrained every conventional approach.

The result: direct stacking of single-crystalline 2D semiconductors (TMDs) on existing circuitry and preserving underlying circuit integrity, and a scalable path to tens or hundreds of stacked logic and memory layers — with orders-of-magnitude improvements in computing density and interlayer communication speed already demonstrated.

FS2 systems are being built for the AI era — delivering supercomputer-level performance in laptop and wearable form factors, and enabling data center-scale intelligence at the edge.

Headquartered in US. Born out of MIT.

FS2

Org chart

Teams

Offices