Dan Smith

Dan Smith is a 3D Packaging Integration Engineer at GLOBALFOUNDRIES, focusing on the development, characterization, and testing of Through-Silicon Vias (TSVs) for 3D chip packaging across various technology nodes. Prior experience includes serving as a Graduate Research Assistant at Rochester Institute of Technology, where involvement in MEMS research encompassed collaboration with private and government partners on various sensing technologies. Dan also held positions as an Electrical Designer II at Merrick & Company, an Electrical Designer at Phillips Gradick Engineering, and completed a QA Internship at Kimberly-Clark. Education credentials include an M.S. in Microelectronics Engineering from Rochester Institute of Technology and a B.S. in Computer Engineering from Georgia Institute of Technology.