Ajit Dubey is an Advanced Technology Partnerships Manager at Google, leveraging over 17 years of experience in semiconductor packaging manufacturing, process engineering, and product development. They have extensive expertise in technologies such as Flip Chip and PBGA package technologies, and have successfully managed product transfers and collaborations with global assembly suppliers. Notable past roles include serving as a Senior Principal Engineer at Broadcom and a Director of IC Package Engineering at Global Foundries, where they led advancements in packaging technologies for cutting-edge processes down to 7nm. Ajit has been recognized with multiple patents, papers, and awards throughout their career, reflecting a strong commitment to innovation in the semiconductor industry.
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