Daniel Liu is a seasoned software engineer with diverse experience in various technology roles. Beginning as an Engineering Intern at Syska Hennessy Group, Daniel contributed to electrical system designs for major commercial projects. Transitioning to a Research Assistant role at UCLA CHFE, Daniel supervised lab operations and engaged in PCB fabrication. With experience as a Software Engineer Intern at ChasePay Inc., Daniel focused on payment gateway functionality before joining Boingo Wireless, where development and maintenance of web services were primary responsibilities. Currently at Google, Daniel leads projects in advertising and cloud machine management, notably enhancing survey response analysis efficiency and managing advanced ML systems for TPU v4. Daniel holds a degree from the University of California, Los Angeles.
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