Dun Tsao

Dun Tsao has an extensive background in hardware engineering and architecture, with notable experience at leading technology companies. Tsao began a career at Compalcomm as a Principal Hardware Engineer from August 2004 to February 2010, followed by a similar role at HTC from March 2010 to March 2013. Tsao then served as a Product Planner at Huawei Consumer Business Group from July 2016 to June 2019 and transitioned to Intel as a Mobile and Tablet Senior Hardware Engineer from April 2013 to July 2016. Afterward, Tsao worked at AMD in an architectural role from November 2019 to June 2022, followed by a brief tenure at Amazon Lab126 as a Hardware Engineer from July 2022 to November 2022. Currently, Tsao is employed as a Hardware Engineer at Google since November 2022. Tsao holds a Master's degree in Electrical, Electronics, and Communications Engineering from National Central University, completed between 2002 and 2004.