Jian Li is a Reliability Engineer for Silicon Packaging at Google since March 2020, bringing extensive experience from a previous role as Principal Engineer at Micron Technology from February 2006 to February 2020, where focus was on R&D, thermal simulation, and management of 3DIC, as well as thermal test chip design and testing. Earlier experience includes an internship at IBM in 2004. Jian Li holds a Doctor of Philosophy (Ph.D.) in Physics with a focus on Material Science from the University of Virginia, completed in 2005, and a Bachelor of Science (BS) in Physics from Nanjing University.
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