Liang Cheng

Liang Cheng has extensive experience in mechanical engineering, particularly in thermal and structural analysis. Key positions include Senior Engineer at Qualcomm, where responsibilities encompassed mechanical simulation-assisted package design optimization, thermal simulation, and the development of automation tools using Python in Abaqus. Prior experience includes roles as a Design Analysis Engineer at Amazon Lab126 and a Mechanical Engineer at Google. Liang Cheng has also contributed to academia as a Teaching Assistant and Research Assistant at the University of Delaware, focusing on solid mechanics and bio-inspired composites. Liang Cheng holds a Ph.D. in Solid Mechanics from the University of Delaware and a Bachelor's degree in Theoretical and Applied Mechanics from the University of Science and Technology of China.