Marcus Hsu is an experienced engineering professional with a strong background in packaging technology and materials science. At Google, from May 2022 to July 2025, Marcus served as a Packaging Engineering Manager and previously held the role of IC Packaging Technologist. Prior to Google, Marcus worked at Qualcomm from October 2011 to May 2022, where responsibilities included serving as a Principal Engineer/Manager and Packaging Engineer. Earlier in Marcus's career, from January 2004 to September 2011, work was conducted at Intel Corporation as a Thermal Area Manager, Module Group Leader, and Process Development Engineer. Marcus holds a Master of Science and Engineering degree in Materials Science and Engineering from the University of Pennsylvania and a Bachelor of Science degree in Chemical Engineering from UC Irvine.
This person is not in the org chart
This person is not in any teams
This person is not in any offices