Ming Hsuan Ai is a Thermal Design Engineer at 谷歌 since June 2023, previously holding the position of Thermal Engineer, Specialist at 廣達電腦 from June 2021 to June 2023 and serving as a Thermal Engineer at Wistron Neweb Corporation from October 2019 to June 2021. Ming Hsuan Ai earned a Bachelor's degree in Power Mechanical Engineering and a Master's degree in Power Mechanical Engineering from 國立清華大學, where studies were completed between 2012 and 2019. Additionally, Ming Hsuan Ai participated as an exchange student in Engineering at 名古屋大学 from 2018 to 2019.
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