Robin Lien has extensive experience in advanced package development and engineering, with a career spanning over two decades. Key roles include Manager of Advanced Package RD at Micron Technology (December 2014 - September 2017), Senior Manager at NXP Semiconductors (January 2013 - December 2014), and Senior Technical Manager at 聯發科 (April 2019 - June 2021). Prior experience also includes Principal Engineer at TSMC (May 2000 - April 2012) and Section Manager at 台積電 (September 2017 - March 2019). Currently, Robin serves as Package Technologist Lead at 谷歌 since June 2021, focusing on advanced package technologies development. Robin holds a Master's degree in Mechanical Engineering from Chang Gung University (1996 - 1998).
This person is not in the org chart
This person is not in any teams
This person is not in any offices