Sheng-Hung Tsai

Sheng-Hung Tsai is an accomplished thermal engineer with extensive experience in thermal analysis and design across multiple leading technology companies. From September 2012 to May 2017, Tsai served as Principal Thermal Engineer at Wistron Neweb Corporation, focusing on integrating chip-level thermal simulation into system-level applications and optimizing thermal solutions. Subsequently, Tsai held positions as Staff Thermal Engineer at Himax Technologies, Inc. and Senior Thermal Engineer at Qualcomm and TSMC, where responsibilities included establishing thermal simulation techniques and providing design recommendations. Currently, Tsai is a SoC Thermal Engineer at Google. Tsai holds a Bachelor's degree in Mechanical Engineering from National Tsing Hua University, graduating with a top rank and GPA, and a Master's degree from National Taiwan University.