Soojeoung Park has extensive experience in the semiconductor industry, currently serving as an Advanced IC Package Technologist at Google since January 2023, following a role as SoC Specialist at Waymo from December 2021 to January 2023. Prior to these positions, Soojeoung held various engineering roles at Samsung Electronics, including Principal Engineer and Technical Leader of D2W Hybrid Bonding Integration, where relevant accomplishments included developing TV design processes and D2W Hybrid Bonding Solutions for HBM3. Soojeoung's early career involved senior-level positions focused on package development and substrate performance improvement. Educational background includes a PhD in Polymer Engineering from The University of Akron, as well as degrees from Tohoku University and Chonbuk National University.
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