Tian Qiu

Tian Qiu is currently the IC Packaging Design Lead at Google, leveraging an extensive background in electrical engineering with a focus on VLSI, IC packaging, PCB, and antenna design. Previously, Tian worked at Intel Corporation, where they served as an IC Package Architect and contributed to advanced packaging technology and heterogeneous integration products. With a master's degree in Electrical and Electronics Engineering from the University of Pennsylvania and a bachelor's degree from Xidian University, Tian has also gained research and teaching experience in integrated circuits and VLSI fundamentals.