Wei Li is an accomplished engineer with extensive experience in thermal management and packaging research. Wei Li began a career as a Research Assistant at Clemson University from August 2009 to August 2016, where significant contributions were made as the primary researcher on NSF and AFOSR-funded projects, including the development of laser diagnostics for turbulent flows. Following this, Wei Li worked as a Thermal Management Engineer at Optimal CAE, Inc. in early 2017, focusing on EV battery module development and cooling design. From August 2017 to November 2024, Wei Li served as a Packaging R&D Engineer at Intel Corporation, supporting advanced packaging technology development through various simulations and experiments. Currently, Wei Li holds the position of IC Package Thermal Mechanical Engineer at Google, starting in November 2024. Wei Li's educational background includes a Bachelor's degree and a Master's degree from Huazhong University of Science and Technology, followed by a Ph.D. in Mechanical Engineering from Clemson University.
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