Xiaopeng Huang

Xiaopeng Huang is an experienced engineer specializing in thermal management and power solutions, with a robust background in research and development across multiple prestigious organizations. At Hewlett Packard Labs, Xiaopeng served as a Research Engineer focused on nonvolatile resistive memory for "the Machine" project, developing multi-physics models and conducting advanced experiments. In subsequent roles at Huawei Technologies and Zeku Technologies, Xiaopeng advanced thermal sensor optimization, developed AI-assisted thermal management software, and contributed to mobile device performance enhancements. As an ASIC Power/Thermal Architect at Google, Xiaopeng is currently involved in developing ASICs for consumer electronics. Xiaopeng's academic qualifications include a Ph.D. in Mechanical Engineering from Iowa State University and multiple degrees in Thermal Engineering and Computer Science from Huazhong University of Science and Technology.