Dave Japp

Silicon Packaging Development Engineer

Dave Japp is an experienced engineer with a focus on electronic design and silicon packaging. Currently serving as a Silicon Packaging Development Engineer at Graphcore since October 2017, Japp specializes in the design and development of high-performance flip chip substrates. Previous roles include Senior Electronic Design Engineer at Renishaw, where employment lasted from August 2011 to October 2017, and significant contributions at Blu Wireless Technology Ltd, where Japp was both a founder and engineer. Additional experience encompasses positions as a Production Engineering Expert at ClearSpeed Technology PLC and Phyworks ltd, as well as roles in evaluation and product solutions at MindSpeed and Pixelfusion Ltd. Japp's educational background includes an HND in Electronics from the University of the West of England and earlier studies at Queen's College, Taunton.

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