王揚智

揚智 (Chace) 王 is a manufacturing package engineer at Graphcore, where they manage packaging engineering initiatives. With over 10 years of experience in flip chip technology, they previously served as a supervisor package engineer at 日月光集團 from 2011 to 2019. They have a history of qualifying significant packages in the industry, including the largest FC package in 2017 and the first CuBOL in FCBGA. Currently, they are pursuing a bachelor's degree in computer engineering at 逢甲大學, having completed a master's in mechanical engineering at 國立臺灣海洋大學.