HaloFreeEtch aims to revolutionize the semiconductor manufacturing industry by developing new, sustainable, halogen-free etching processes for silicon and silicon oxide. 
Traditional industrial plasma etching processes rely on halogens, which pose significant environmental and health risks. By replacing these with more sustainable alternatives, the project seeks to reduce the carbon footprint and improve the overall sustainability of semiconductor manufacturing. 
The core objectives of HaloFreeEtch include:

•	Development of Novel Etching Processes: Identifying and developing clean, efficient, and precise halogen-free etching processes.
•	Sustainability and Life Cycle Analysis: Providing a novel model- and data-based methodology to quantify the carbon footprint of new etching processes.
•	Interdisciplinary Research: Combining lab-scale research with computational screening and multi-scale modeling to predict potential working points for new etching methods.
•	Industrial Application: Modifying state-of-the-art plasma etching machines and combining them with innovative features and advanced analytics to ensure applicability in industrial settings.


"Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Innovation Council and SMEs
 Executive Agency (EISMEA). Neither the European Union nor the granting authority can be held responsible for them.”


HaloFreeEtch

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HaloFreeEtch

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