Loveday Dike is a Senior Hardware Design Engineer for Telematics & Connectivity Systems at HARMAN International (Samsung). They previously held the position of Hardware Design Engineer and have played a key role as a Hardware Expert in RF system design and GNSS. Prior to HARMAN, Loveday worked as a Hardware Development Engineer at ACD Elektronik GmbH and served as a Research Assistant at the Institute of Microelectronics at Universität Ulm. Loveday earned a Master’s degree in Electrical and Electronics Engineering from Universität Ulm from 2010 to 2013.
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