Buddika Gajapala is a seasoned technology professional with extensive experience in software engineering and architecture. Currently serving as a Senior Principal Engineer and Lead Software Architect at HERE Technologies since March 2012, Buddika plays a crucial role in providing location information for B2B systems. Previously, Buddika held the position of Assistant Vice President at Bank of America, specializing in systems for OTC products related to Credit and Rate Derivatives. Additional roles include Senior Technical Architect at Washington Mutual Bank, Senior Software Developer at VitalFlash Inc., and Software Consultant at The Chase Manhattan Bank. Buddika's educational background includes a Master's degree in Computer Science from the Illinois Institute of Technology and a Bachelor's degree in Computer Science and Engineering from the University of Moratuwa.
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