陈浩

Director of Analog Chip&IP Test and Aplication

Jingjing Wu

Senior TSR

Ze Zhu

Principal Packaging Engineer

林强

System Engineer

Jack Lin

DFX design team leader

陈伟华

可靠性工程师

Jian Tan

TSR

张弛

封装设计工程师

Gary Leung

Project Manager & Principal Engineer

漆文龙

高级工程师

William Zhou

数字IC验证工程师

严斌

高级工程师

李帅旗

数字芯片设计工程师

Ping Chen

Chief SoC Architect

Zebulon Wong

Senior IC Packaging Engineer/Technical Leader

Rio Li

Senior SoC Verification Engineer

Zhaohua Yang

Senior Verification Engineer

Lurong Shen

HRBP

Daojing Tian

IC Digital Designer

Ian CAI

Global TA Head

程昶

Chief Engineer

陆光易

工程师

胡贻升

Analog Design Flow Expert

YIXUAN HU

Senior Engineer （CPU Architect & Machine Learning）

Dong Liu

Technical Expert

刘运锋

项目经理

Yue Pan

Principal Engineer

Hua Chunlai

Senior ASIC Design Engineer

Hongming Yang

Principal Engineer, AI team leader

Runqiu（Ryan） Yang

Hisilicon Financial Management Department

代兵

IC Layout Engineer

Xiao HU

IC Packaging Engineer

王钿

TDT 开发代表

付一伟

Reliability Engineer

秦斌

高级产品专家 芯片规划

Tao Zeng

SR.Staff Software Engineer

Chong He

模拟IC设计工程师

li morde

集成电路工程师

傅晓

数字设计验证TMG主任

songlin wu

测试经理

梁灿灿

数字芯片设计，主任工程师

Ailia Cao

Talent Acquisition Project Manager

Ryan Yu

NPU Architect

Zhichang Yuan

System Engineer

connie peng

招聘经理

鸿雁

高级软件工程师

王海峰

主任工程师

Simin Tao

Software Engineer

Edwin Wu

ASIC Design Engineer

许涛

图像质量工程师