Andy Yang is a Senior Digital Design Engineer at 海思 since September 2021, specializing in emerging NVM technology. Prior to this role, Andy served as a Senior Engineer at 超捷半导体有限公司 from November 2014 to September 2021, managing the installation of ESF1 and ESF3 technologies, characterizing HV devices and flash cells, and collaborating on product verification and qualification. From October 2010 to November 2014, Andy worked at 上海华力微电子有限公司 as a Senior Process Integration Engineer, focusing on process flow installation and maintenance for yield improvement and defect reduction. Andy began the career as a Process Integration Engineer and Process Engineer at 中芯国际集成电路制造(上海)有限公司 from July 2008 to October 2010, responsible for new product tape-out and Ashing Process development. Education includes a Master's degree in Integrated Circuit Design and Integration Systems from Fudan University (2011-2013) and a Bachelor's degree in Microelectronics from Xidian University (2004-2008).
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