Bin Han is a Principal R&D Engineer at Hisilicon, leading the optical component packaging development team in the OE department. Previously, Bin held the position of Senior R&D Engineer at NeoPhotonics from 2014 to 2016 and worked as a Senior Process Engineer at JDSU from 2007 to 2014. Bin earned a Bachelor of Engineering in Precision Instrument from Tianjin University and a Master of Engineering in Optical Engineering from the Chinese Academy of Sciences.
Location
China
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