高建玉 Henry

建玉 Henry 高 is a seasoned professional with 17 years of experience in the semiconductor industry. They have held roles such as Engineer and Manager of SPICE Modeling at 中芯国际 from 2010 to 2018 and are currently a 技术专家 at 海思, specializing in SPICE model device modeling since 2021. Additionally, they began their career as an engineer at 中国电子科技集团第五十五研究所 in 2003. Henry holds a Master’s degree in Microelectronics and Solid-State Electronics from 兰州大学, which they completed in 2003.