William Li

William Li has extensive experience in mobile phone chipset and solution planning, business development, and marketing. Currently, at 海思 since October 2006, William serves as the European Marketing Director and Sr. Marketing Director, leading initiatives on the K3 Smartphone Application Processor and Balong modem chipset through marketing research and product management. Prior to this role, William worked at Datang LeadCore Technology from September 2003 to October 2006 as a Hardware R&D Project Leader, focusing on TDS/GSM chipset development and smartphone solution design. Early career experience includes a position as a Hardware R&D Engineer at Shanghai ARES Communications from July 2002 to April 2003, where William was involved in PMU/audio codec circuit design for GSM phones. William holds a Bachelor's degree in Electrical, Electronics, and Communications Engineering from Zhejiang University.