Yang Cheng

Yang Cheng is a Senior Engineer at Hisilicon, where they have been contributing since 2020. Prior to this role, they worked as a TD Integration/Device Engineer at Intel from 2017 to 2020. Yang was a Graduate Research Assistant at the University of Oklahoma's Gallogly College of Engineering from 2013 to 2017, focusing on carrier transport in quantum dot solar cells. They also held the position of Graduate Teaching Assistant at the University of Oklahoma from 2012 to 2013. Yang holds a Ph.D. in Engineering Physics/Applied Physics from the University of Oklahoma, as well as a master’s and bachelor’s degree in Physics from the same institution and Zhejiang University, respectively.