BS

Bo Song

MEMS Packaging Engineer

Bo Song is a skilled engineer and researcher with a background in materials science and chemistry. Experience includes a role as a Senior Process Engineer at GLOBALFOUNDRIES, a Researcher at Howard Hughes Medical Institute, and currently serving as a MEMS Packaging Engineer at HP since September 2018. Academic achievements consist of a PhD candidacy in Materials Science from Georgia Institute of Technology, where Bo Song worked as a Graduate Research Assistant, and a Bachelor of Science in Materials Chemistry obtained from Binghamton University, where research involvement began as an Undergraduate Research Assistant.

Location

Corvallis, United States

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