Brian Tan BC is a seasoned System Engineering Program Manager with extensive experience in the engineering field. They held positions such as Moldmaker group leader at Flextronics Mould Mfg Pte Ltd from 2000 to 2006, and Senior Tooling Engineer/NPI at Verifone from 2015 to 2018. Brian’s career also includes roles as Engineering Manager at Moveon Technologies and Staff Engineer at Sanmina, contributing to their expertise in mechanical and tooling engineering. Currently, Brian is engaged in Mechanical/Hardware Engineering at HP, further solidifying their diverse background in precision engineering.
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