Chaw Lim is currently the MEMS Fab Engineering Manager at Hewlett-Packard Singapore Ptd Ltd, where they lead SMART Manufacturing projects and oversee new product introductions. Previously, Chaw worked as a Senior NPI/Process Engineer at HP since 2013 and as a Senior Process Engineer at STMicroelectronics from 2009 to 2013, where they led various processes and product transfers. Early in their career, Chaw was a product engineer at WD, a Western Digital company, in 2009. They earned dual Bachelor's degrees in Material Science and Material Engineering from Universiti Sains Malaysia from 2004 to 2008.
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