Michael Cumbie is a HP Distinguished Technologist with extensive experience in CMOS/MEMS and microfluidics technologies. From 2003 to 2009, they held multiple roles at Hewlett-Packard, including R&D Product Engineer and R&D Lead MEMS/CMOS Integration Engineer, where they drove innovation in thermal inkjet product development. In their current role, they lead cross-functional teams to architect advanced solutions and oversee product lifecycles. Michael earned a B.S. in Electrical Engineering from Oregon State University and a certificate from the HP Building Innovative Leaders Program at Stanford University.
Location
Corvallis, United States
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