Sam Hsiao is a Mechanical/Thermal Program Manager with over 20 years of professional experience in notebook design, specializing in mechanical design and electronics cooling. They currently work as a Mechanical Program Manager (Thermal) at HP, where they apply their extensive knowledge in new technology development and supplier management. Previously, Sam served as a Supervisor of Thermal/Acoustic Management at 和碩聯合 and as an Account Manager of Thermal/Acoustic Management at 華碩, where they led teams in delivering successful product designs. Sam holds a Master of Business Administration in Industrial Engineering of Management from 國立臺北科技大學.
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