Tom J.

Tom J. is an innovative TPM with a strong background in hardware design validation and program management. They served as Thermal Testing Lead at Nokia Siemens Networks from 2011 to 2013, where they conducted thermal tests for ATCA and BCN. Tom J. then contributed to HP from 2016 to 2020 in various roles, including Solution Program Manager and Program Manager of Value Engineering. Prior to that, Tom J. worked at 英业达 from 2006 to 2011 as a Hardware Design Validation Supervisor, leading a team on hardware design validation for server products. They earned a bachelor's degree in physics from 苏州大学 in 2004.