Alpha Feng

Alpha Feng is an experienced soc designer at Huawei since August 2016, specializing in short distance wireless communication chip development. Prior to this role, Alpha Feng worked as an IC Digital Design Engineer at Micron from January 2010 to February 2015, where responsibilities included overseeing ASIC development processes, architecture design, logic design, and system simulation. Additionally, Alpha Feng served as a Design Engineer at Numonyx from July 2009 to 2010 and completed an internship focused on low power digital design at Intel from December 2008 to July 2009. Alpha Feng holds a Bachelor of Science degree in Material Science and Technology from Shanghai University, earned between 2005 and 2009.