Boyang Wang is a Senior Hardware Engineer at Huawei since September 2021, bringing extensive experience in hardware and software development. Previously, Boyang served as a Research Assistant and Teaching Assistant at the Illinois Institute of Technology from February 2015 to January 2022, focusing on ultrasonic signal processing, embedded systems, and artificial intelligence while mentoring over 30 student projects. At Argonne National Laboratory, Boyang led the creation of an advanced ultrasonic communication testbed from March 2017 to March 2018. An early career internship at the Beijing IC Design Park involved designing a digital integrated circuit, and educational qualifications include a Master of Science in Electrical and Electronics Engineering and a Bachelor's degree from the Beijing Institute of Technology.
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