ChingHan Huang is a Senior Department Manager at ASE Chungli, specializing in semiconductor process integration and new MEMS and optical sensor package development. With extensive experience in wafer bonding technologies, ChingHan has contributed to various innovations in sensor applications and packaging solutions for multiple industries, including smart automotive systems and IoT. Previously, ChingHan held roles as Chief Scientist at Huawei Technologies and Principal Engineer at Touch Micro-System Technology Corp., and is a PhD graduate from National Central University. Additionally, ChingHan has been an invited speaker at numerous international conferences, sharing insights on advanced packaging solutions and smart sensor technologies.
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