Dan Yang

Dan Yang has over a decade of experience in the field of engineering, specializing in package engineering and reliability. Currently, Dan Yang works at Huawei Technologies since March 2015, focusing on package engineering and reliability. Prior to this role, Dan Yang gained valuable experience at Microsoft as a reliability engineer from March 2013 to March 2015 and at ASTRI, where responsibilities included electronic package design and analysis from January 2009 to March 2013. Dan Yang holds a Ph.D. in Electronic Engineering from the City University of Hong Kong, as well as a Master's degree in Microelectronics and Solid State Electronics and a Bachelor's degree in Electronic Components and Materials from South China University of Technology.