Denny Chu is a Principal Engineer at 華為技術有限公司, where they develop new products and collaborate with various stakeholders to ensure customer requirements are met within project timelines. Previously, as a Senior Process Engineer at ASM from 2012 to 2023, Denny focused on optimizing high-speed flip chip bonders and performed extensive data analysis to enhance machine functionality. Denny earned a Bachelor of Science in Mathematics and Physics with first-class honors from 香港科技大學 in 2012.
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