Mark 王猛 is a Photonic Packaging Development Manager and Senior Technical Expert at Huawei Hisilicon, where they lead packaging process strategy and new product introduction for optical components. Previously, Mark served as a Process Development Manager at OCLARO, handling engineering management and optical module packaging processes from 2004 to 2012. They also held roles at Huawei and Hitachi GST, where they contributed to package design and fab equipment management. Mark earned an MBA in Business Administration from Huazhong University of Science and Technology between 2009 and 2011.
Location
Shenzhen, China
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