Meng Liu is a seasoned professional with eighteen years of experience in the semiconductor industry, currently serving as the Vice President of Semiconductor Packaging at Huawei. Previously, Meng held various leadership roles at Infineon Technologies, including Director of Automotive Power Module Development Projects, where significant contributions were made in marketing, strategy, and mergers and acquisitions. Meng holds an EMBA from INSEAD and Tsinghua University, along with Bachelor’s degrees in Automotive Engineering from Tsinghua University and RWTH Aachen. Meng is dedicated to fostering cross-cultural collaborations and driving innovation to enhance competitive edge in products and technologies.
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