Nesty Tseng has extensive experience in the semiconductor industry, holding various leadership and engineering positions. Nesty served as a Principal Engineer at Broadcom, focusing on the design and integration of analog modules for mobile phone solutions and negotiating technical requirements with Samsung. Prior to that, as a Manager at Realtek Semiconductor Corp., Nesty developed specifications for WiFi connectivity products and engaged in system-level design and verification. Nesty also held managerial responsibilities at Macronix International Co., LTD, ensuring timely delivery of chips, and later worked as a Technical Manager at TSMC, where Nesty developed strategies for Ultra-Low-Power SoC design. Currently, Nesty is a Senior Chip Design Expert at Huawei Technologies, providing insights into semiconductor industry trends and advancing chip design concepts for future technologies.
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