慧芳 焦 is the IC TMG Chair and has been with 华为 since 2011, serving as a Memory Senior Principal Engineer and Component Senior Reliability Principal Engineer. Prior to this, they worked at 中国赛宝 from 1988 to 2011 as an IC Reliability Researcher. Their extensive experience in technology management and reliability engineering highlights their expertise in the semiconductor field.
Location
Shenzhen, China
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