传平 闫 is currently a 高级工程师 specializing in chip physical design at 华为 since 2017. They previously held senior engineering positions at Memblaze Technologies, Verisilicon, and Starblaze Technology between 2013 and 2016. 传平 earned a master's degree in Communication and Information Systems with a focus on ASIC from 电子科技大学 from 2010 to 2013.
Location
Chengdu, China
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