Hybrid Integration helps innovators navigate microelectronics and photonics packaging challenges with confidence. 

Advanced packaging doesn’t have to be complicated. We work as your technical partner, taking the time to understand your goals, develop the right solution and deliver a result that helps move your innovation forward. We make the process simple, with a commitment to transparent communication and accountability throughout.

We provide flexible involvement from targeted technical input to full end-to-end project delivery. Our capabilities include:
•	Consultancy, design, modelling, simulation and assembly
•	Custom packaging processes, optical fibre and PIC coupling, die attach and flip-chip
•	Project coordination, testing, validation and failure analysis
•	Other specialist services tailored to your project

Our work spans sectors such as semiconductors, photonics, quantum, aerospace, AI and more. 

Based in Paignton, we benefit from the South West’s rich history in microelectronics and photonics, with access to specialist facilities, equipment and expertise.

If you’re tackling an advanced packaging challenge or need help working out the right approach, we’d love to hear from you.

Hybrid Integration

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Hybrid Integration

Org chart

Teams

Offices

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